InfoCoBuild

Electrical Engineering 143: Microfabrication Technology

Electrical Engineering 143: Microfabrication Technology (Fall 2014, UC Berkeley). Instructor: Professor Clark Tu-cuong Nguyen. Microfabrication Technology - Integrated circuit device fabrication and surface micromachining technology. Thermal oxidation, ion implantation, impurity diffusion, film deposition, epitaxy, lithography, etching, contacts and interconnections, and process integration issues. Device design and mask layout, relation between physical structure and electrical/mechanical performance. MOS transistors and poly-Si surface microstructures will be fabricated in the laboratory and evaluated.

Lecture 06 - Process Integration: Example NMOS Process, Masks and Alignment

Time Lecture Chapters
[00:00:00] 1. Example NMOS Process
[00:46:30] 2. Mask to Cross-Section
[01:09:25] 3. Masks and Alignment

Go to the Course Home or watch other lectures:

Lecture 05 - Process Module Overview, Process Integration: NMOS Process
Lecture 06 - Process Integration: Example NMOS Process, Masks and Alignment
Lecture 07 - Masks and Alignment, Four Main Components of Lithography
Lecture 08 - Lithography: Masks and Alignment, Design Rules, Resolution
Lecture 09 - Lithography: Resolution, Linewidth Control/ Thermal Oxidation of Silicon
Lecture 10 - Oxidation: Theory, Graphs
Lecture 11 - Oxidation: Graphs, Dopant Redistribution/ Film Deposition: Evaporation
Lecture 12 - Film Deposition: Sputtering, Chemical Vapor Deposition
Lecture 13 - Film Deposition: CVD, ALD/ Metal Electroplating/ Etching
Lecture 14 - Etching: Selectivity, Wet Etching, Dry Etching
Lecture 15 - Etching: Dry Etching, Chemical Mechanical Polishing/ Ion Implantation
Lecture 16 - Ion Implantation: The Basic Process, I/I Statistics, Junction Depth
Lecture 17 - Diffusion: Basic Process for Selective Doping
Lecture 18 - Diffusion: Predeposition, Diffusion Modeling
Lecture 19 - Diffusion: Successive Diffusions
Lecture 20 - Diffusion: Determining Junction Depth, Sheet Resistance, Measuring Resistance
Lecture 21 - Interconnects and Contacts
Lecture 22 - Interconnects and Contacts (cont.), CMOS Process
Lecture 23 - CMOS Process Flow, Metal MEMS, Advanced Isolation
Lecture 24 - Advanced Isolation (cont.), MOS CV
Lecture 25 - MOS CV, Vt Implant
Lecture 26 - Device Characterization