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Micro and Smart Systems

Micro and Smart Systems. Instructors: Prof. K. N. Bhat, Prof. G. K. Ananthasuresh, Prof. S. Gopalakrishnan, and Dr. K. J. Vinoy, Department of Electrical Communication Engineering, IISc Bangalore. This interdisciplinary course not only gives an overview of the micro and smart systems technologies but also gives an in-depth understanding of the issues involved. It begins by answering the important question: why miniaturize? This is followed by a quick summary of a variety of sensors, actuators, and systems. It then presents a comprehensive description of microfabrication. This is followed by a detailed discussion of mechanics of solids as it pertains to micro and smart systems. While this part may be viewed as strength of materials and design, an effort is made to relate this to micro devices and discuss such topics as residual stress and stress gradients, lumped modeling using energy methods, anticlastic curvature, etc. The discussion ends with general equations of elasticity and their solution is discussed next using the finite element method. Here, too the basics and advanced topics are interleaved to provide a thorough understanding of the finite element method. After this, electronics circuits, control, and packaging are also presented. (from nptel.ac.in)

Lecture 15 - Deformation Strains and Stresses


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Introduction to Micro and Smart Systems
Lecture 01 - Glimpses of Microsystems: Scaling Effects
Lecture 02 - Smart Materials and Systems
Lecture 03 - Microsensors
Lecture 04 - Microactuators
Lecture 05 - Microsystems: Some Examples
Lecture 06 - Smart Systems Application and Structural Health Monitoring
Microfabrication Processes
Lecture 07 - Microfabrication Technologies
Lecture 08 - Thin Film Materials and their Deposition
Lecture 09 - Approaches for Pattern Transfer
Lecture 10 - Surface Micromachining of Microstructures
Lecture 11 - Bulk Micromachining of Microsystems
Lecture 12 - Extended Approaches for Working Microsystems
Lecture 13 - Non-conventional Approaches for Microsystems
Lecture 14 - Packaging of Microsystems
Mechanics of Slender Solids
Lecture 15 - Deformation Strains and Stresses
Lecture 16 - Microdevice Suspensions: Lumped Modeling
Lecture 17 - Residual Stress and Stress Gradients
Lecture 18 - Torsion and Twist
Lecture 19 - Vibrations of Microsystems Devices
Lecture 20 - Vibrations of Microsystems Devices: Micromachined Gyroscopes
Lecture 21 - Vibrations of Microsystems Devices, Modeling of Coupled Electrostatic Microsystems
Lecture 22 - Modeling of Coupled Electrostatic Microsystems (cont.)
Lecture 23 - Coupled Electrothermal-elastic Modeling
Lecture 24 - Modeling of Microsystems: Scaling Effects
Finite Element Method
Lecture 25 - Finite Element Method and Microsystems
Lecture 26 - Theoretical Basis for the Finite Element Method
Lecture 27 - Energy Theorems and Weak Form of the Governing Equation
Lecture 28 - Finite Element Equation Development and Shape Functions
Lecture 29 - Isoparametric FE Formulation and Some Examples
Lecture 30 - Finite Element for Structures with Piezoelectric Material
Electronics and Packaging
Lecture 31 - Semiconductor Device Physics
Lecture 32 - BJT and MOSFET Characteristics and Op-Amps
Lecture 33 - Op-Amp Circuits and Signal Conditioning for Microsystems Devices
Lecture 34 - Control and Microsystems
Lecture 35 - Vibration Control of a Beam
Lecture 36 - Signal Conditioning Circuits and Integration of Microsystems and Microelectronics
Lecture 37 - Pressure Sensor Design Concepts, Processing, and Packaging
Lecture 38 - Pressure Sensor Design Concepts, Processing, and Packaging (cont.)
Lecture 39 - Capacitive Micro-accelerometer
Lecture 40 - Capacitive Micro-accelerometer (cont.)